征求意见截止日期为2004年7月5日的补充豁免提议：
1. Lead used in compliant-pin VHDM (Very High Density Medium) connector system,
软管脚VHDM（很高密度的介质）连接器系统，
2. Lead as a coating material for a thermal conduction module c-ring,
用于C型环热传导模式涂层材料中的铅，
3. Lead and cadmium in optical and filter glass,
用于光学玻璃和滤色玻璃中的铅和镉，
4. Lead in optical transceivers for industrial applications,
用于工业用途的光学收发器，
5. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 85% in proportion to the tin-lead content (exemption until 2010),
组成元素多于两种，用来连接管脚和微处理器的外壳，在锡－铅的含量比例中，铅含量高达85％以上的焊锡中的铅（准许免除直到2010年），
6. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead) and any lower melting temperature solder required to be used with high melting temperature solder to complete a viable electrical connection,
高熔化温度的焊锡（比如：含铅量大于85％的锡－铅焊锡合金）和所有熔化温度稍低一些的焊锡中的铅与高熔化温度焊锡一起来完成实际的电气接，
7. Lead in solders to complete a viable electrical connection internal to certain Integrated Circuit Packages (Flip Chips) (exemption until 2010),
完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊锡中的铅（准许免除直到 2010年），
8. Article 4(1) substances in safety equipment for fire and rescue services,
用于火灾和急救设施的安全装置，
9. Lead in lead-bronze bearing-shells and bushes,
铅-铜轴承壳套和衬套中的铅。