欧盟第2005/747/EEC决议包含的豁免条款：
1、Lead used ian compliant pin connector systems,
顺应针脚连接系统中使用的铅，
2、Lead as a coating material for the thermal conduction module c-ring,
用于C型环热传导模式涂层材料中的铅，
3、Lead and cadmium in optical and filter glass,
用于光学玻璃和滤色玻璃中的铅和镉，
4、Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight,
组成元素多于两种，用来连接管脚和微处理器的外壳，含铅量以质量计超过80％、但少于85％的焊料中的铅，
5、Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。

此外，欧盟第2005/747/EEC决议还对RoHS指令附带的豁免清单第7条和第8条进行了修改。修改后的条款如下：
“7. --Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
--lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
--lead in electronic ceramic parts (e.g. piezoelectronic devices).”
“7. --高熔点型焊料中的铅（即铅基焊料合金中铅含量按质量计可达到或超过85%），
--用于服务器、存储器和存储阵列系统，以及用作交换、信号、传输及电信网络管理的网络基础设施设备中焊料中的铅，
--电子陶瓷产品（如压电装置）中的铅。

“8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.”
“8.电气插头及镉镀层所含的镉及其化合物，修改关于限制特定危险物质和预制品销售和使用的第76/769/EEC 号指令的第91/338/EEC 号指令禁止的镉电镀除外。”