征求意见截止日期为2006年5月15日的补充豁免提议：
   1. Cadmium and cadmium oxide in thick film pastes used on beryllium oxide substrates until January 1, 2008;
   1. 用在氧化铍基层上的厚膜浆料中的镉和氧化镉，直至2008年1月1日；
   2. Gaskets of butyl rubber material vulcanised with chinondioxim and lead tetraoxide, for use in Aluminium Electrolytic Capacitors;
   2. 用在铝质电解电容器中，带有chinondioxim和四氧化三铅（红丹）的硬化丁基橡胶材料垫圈；
   3. Sharp LQ104X2LX11 (formerly Fujitsu FLC26XGC6R-01);
   3. 夏普LQ104X2LX11 (原富士FLC26XGC6R-01)；
   4. Quartz Crystal Resonator and in Fine Pitch Electronics Systems used in the Swiss Watch Industry;
   4. 用于瑞士手表工业，小螺距电子系统中的石英水晶共鸣器；
   5. Cadmium in opto- electronic components;
   5. 光电子元件中的镉；
   6. Transducers used in professional loudspeaker systems, using tin-lead solder;
   6. 用于专业扬声系统，使用锡铅焊料的变频器；
   7. Tin-lead solder in the manufacture of professional audio equipment;
   7. 专业音频设备制造中使用的锡铅焊料；
   8. Components used in the manufacture of the Hog1000, Hog500, Event416, Event408, ESP2-24 and ESP2-48 lighting control consoles;
   8. 制造Hoq1000、 Hog500、 Event416、 Event408、ESP2-24和ESP2-48 光线控制台使用的元件；
   9. Specific modular units, including tin-lead solder, being used in special professional equipment;
   9. 用于特殊专业设备的特定模块单元，包括锡铅焊料；
  10. Inventory of special ICS having tin-lead solder on/in leads/balls, used in specialist/professional equipment;
  10. 用于特定或专业设备，在铅体或球体的里面或外部带有锡铅焊料的特殊ICS产品；
  11. Cadmium Mercury Telluride;
  11. 碲汞镉；
  12. Lead contained in Babbit lined bearings;
  12. 巴氏合金衬套轴承中的铅；
  13. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers;
  13. 用于大功率扬声器，在变频器中直接装置到受话器的电导体上，作为电气/机械焊料的镉合金；
  14. Thermal cutoff with a fusible element that contains lead (and possibly cadmium, mercury and hexavalent chromium) for applications where normal operating temperature exceeds 140 C and reliable, predictable, operation for a minimum of 30,000 hours is required;
  14. 用于通常在140 摄氏度以下操作，可预见操作时间不少于30，000小时的电器，带有含铅（并且可能含镉、汞和六价铬）可熔元素的隔热档板；
  15. Mercury free flat panel lamp;
  15. 无汞平板灯；
  16. Electronic equipment where the reliability, durability and longevity of the equipment is paramount;
  16. 可靠、耐用、长寿的电子设备；
  17. Semi Red Brass C84400, 81-3-7-9 or a similar Brass material. Used on radio frequency line sections;
  17. 用于音频线段的半红铜C84400、81-3-7-9 或相似的铜材料；
  18. Lead is used as an alloy to the copper in 6 to 8 % by weight. Needed for casting and machinability characteristics;
  18. 符合铸造和切削特点的要求，使用重量占6－8％的铅作为铜的合金元素；
  19. Lead in solders for electronic equipments used for the monitoring, the protection and the safety of people in  healthcare, telecare and emergency calls domains in professional and private sectors;
  19. 在专业和私人领域用于医疗卫生、电话求助和急救呼叫范围内人员的监控、保护和安全的电子设备焊料中的铅；
  20. FPGA devices manufactured by Xilinx (XC5202-6VQ100C, XC4003E-3VQ100C and XC4013E-3PQ240C) containing lead solder (Pb) used in the plating of the device terminations;
  20. 用于设备终端镀层中，Xilinx（XC5202-6VQ100C、XC4003E-3VQ100C和XC4013E-3PQ240C）制造的含铅焊料的FPGA设备；
  21. Lead oxide in seal frit used for making window assemblies for argon and krypton laser tubes;
  21. 用于氩和氪激光管窗体组件制造的密封釉料中的氧化铅；
  22. Smart card readers (product: GemSelf700-MS2, GCR700-3ZS, Vodafone D2 , GCR760 and GemSelf750 SV);
  22. 智能读卡器（产品：GemSelf700-MS2、GCR700-3ZS、Vodafone D2 、GCR760和GemSelf750 SV）；
  23. Use of mercury in Babcock’s DC plasma displays and use of Lead Oxide (PbO) in Babcock’s DC plasma displays frit seal.
  23. 在Babcock’s数码相机等离子显示器中使用汞，在Babcock’s数码相机等离子显示器熔接密封中使用氧化铅（PbO）。